Electronic device including antenna and heat dissipation structure

ABSTRACT

Electronic device includes a housing including a conductive portion, an antenna module disposed in an inner space of the housing and including printed circuit board (PCB) disposed in the inner space, including a first surface and a second surface facing a direction opposite to the first surface, at least one antenna element disposed on the first surface of the PCB or near the first surface in the PCB, a wireless communication circuit disposed on the second surface and configured to transmit and/or receive a radio signal through the at least one antenna element, a protective member disposed on the second surface of the PCB to surround at least partially the wireless communication circuit, and a conductive shielding layer disposed on the protective layer, and a conductive member connected to the conductive portion of the housing and facing the conductive shielding layer of the antenna module at least in part.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Continuation of U.S. application Ser. No.16/848,121, which was filed in the U.S. Patent and Trademark Office onApr. 14, 2020, and claims priority under 35 U.S.C. § 119 to KoreanPatent Application No. 10-2019-0043503, which was filed in the KoreanIntellectual Property Office on Apr. 15, 2019, the entire disclosure ofeach of which is incorporated herein by reference.

BACKGROUND 1. Field

The disclosure relates to an electronic device including an antenna anda heat dissipation structure.

2. Description of Related Art

With the development of wireless communication technology, electronicdevices (e.g., communication electronic devices) are commonly used indaily life; thus, use of contents is increasing exponentially. Becauseof such rapid increase in the use of contents, a network capacity isreaching its limit. After commercialization of 4th generation (4G)communication systems, in order to meet growing wireless data trafficdemand, a communication system (e.g., 5th generation (5G) or pre-5Gcommunication system, or new radio (NR))) that transmits and/or receivessignals using a frequency of a high frequency (e.g., millimeter wave(mmWave)) band (e.g., 3 GHz to 300 GHz band) is being studied.

Next-generation wireless communication technologies are currently beingdeveloped to permit signal transmission/reception using frequencies inthe range of 3 GHz to 100 GHz, overcome a high free space loss due tofrequency characteristics, implement an efficient mounting structure forincreasing an antenna gain, and realize a related new antenna module.This antenna module may include an array-type antenna module in whichvarious numbers of antenna elements (e.g., conductive patches) arearranged at regular intervals. These antenna elements may be disposed inan electronic device so as to form a beam pattern in one direction.

The electronic device may include a metal structure such as a conductivelateral member so as to reinforce the rigidity and create a beautifulappearance. This metal structure is disposed as a unit conductiveportion between a pair of non-conductive portions (e.g., segments)spaced at a certain distance and is electrically connected to a wirelesscommunication circuit, thus, operating as a legacy antenna moduleconfigured to transmit and/or receive a radio signal having a frequencyin the range of about 800 MHz to 3000 MHz.

In addition, when the above-described mmWave antenna module and thelegacy antenna module are disposed in close proximity to each other, theelectronic device may be confronted with a degradation of radiationcharacteristics of the antenna modules due to mutual signalinterference. Moreover, the mmWave antenna module may require anadditional heat dissipation structure for not only dissipating heat butalso shielding noise generated by transmitting and/or receiving highfrequency signals.

SUMMARY

An aspect of the disclosure provides an electronic device that includesan antenna and a heat dissipation structure.

Another aspect of the disclosure provides an electronic device thatincludes an antenna and a heat dissipation structure configured toperform a function of shielding noise due to signal interference with anantenna module disposed nearby.

According to various embodiments of the disclosure, an electronic devicemay include a housing including a conductive portion. The electronicdevice may include an antenna module disposed in an inner space of thehousing. The antenna module may include a printed circuit board (PCB)disposed in the inner space and including a first surface and a secondsurface facing a direction opposite to the first surface, at least oneantenna element disposed on the first surface of the PCB or near thefirst surface in the PCB, a wireless communication circuit disposed onthe second surface and configured to transmit and/or receive a radiosignal through the at least one antenna element, a protective memberdisposed on the second surface of the PCB to surround at least partiallythe wireless communication circuit, and a conductive shielding layerdisposed on the protective layer. The electronic device may furtherinclude a conductive member connected to the conductive portion of thehousing and facing the conductive shielding layer of the antenna moduleat least in part.

According to various embodiments of the disclosure, an electronic devicemay include a housing. The electronic device may further include adevice substrate disposed in an inner space of the housing and includinga first ground layer, and an antenna module disposed adjacent to thedevice substrate. The antenna module may include a printed circuit board(PCB) disposed in the inner space and including a first surface and asecond surface facing a direction opposite to the first surface, atleast one antenna element disposed on the first surface of the PCB ornear the first surface in the PCB, a wireless communication circuitdisposed on the second surface and configured to transmit and/or receivea radio signal through the at least one antenna element, a protectivemember disposed on the second surface of the PCB to surround at leastpartially the wireless communication circuit, and a conductive shieldinglayer disposed on the protective layer. The electronic device mayfurther include a conductive member disposed in the inner space andincluding a first portion electrically connected to the conductiveshielding layer and a second portion connected to the first portion andelectrically connected to the first ground layer of the devicesubstrate.

According to various embodiments of the disclosure, a portablecommunication device may include a housing including a conductiveportion forming at least a part of a lateral surface of the portablecommunication device. The portable communication device may include anantenna module disposed in the housing and including a printed circuitboard (PCB) having a first surface facing the lateral surface and asecond surface facing, a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the lateral surface, and a communicationcircuit disposed on the second surface and electrically connected to theone or more antennas. The portable communication device may furtherinclude a shielding member surrounding at least in part thecommunication circuit, a support member supporting the antenna moduleand having a conductive material, and an electric shock preventionmember positioned to contact the shielding member and the supportmember. At least a part of a noise generated by the communicationcircuit in a direction different from a radiation direction of theantenna module may be passed to the support member through the electricshock prevention member, and a current passed to the support memberthrough the electric shock prevention member may be reduced.

According to various embodiments of the disclosure, a portablecommunication device may include a housing including a conductiveportion forming at least a part of a lateral surface of the portablecommunication device. The portable communication device may include anantenna module disposed in the housing and including a printed circuitboard (PCB) having a first surface facing the lateral surface and asecond surface facing a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the lateral surface, and a communicationcircuit disposed on the second surface and electrically connected to theone or more antennas. The portable communication device may furtherinclude a shielding member surrounding at least in part thecommunication circuit, a support member supporting the antenna moduleand having a conductive material, and an electric shock preventionmember positioned to contact the shielding member and the support memberand having a specific capacitance. An alternating current (AC) couplingmay be formed between the shielding member and the support member, basedon the specific capacitance.

According to various embodiments of the disclosure, a portablecommunication device may include an antenna module including a printedcircuit board (PCB) having a first surface and a second surface facing adirection opposite to the first surface, one or more antennas disposedon at least a portion of the PCB to transmit or receive a signal throughthe first surface, and a communication circuit disposed on the secondsurface and electrically connected to the one or more antennas. Theportable communication device may further include a shielding membersurrounding at least in part the communication circuit, and an electricshock prevention member positioned to contact the shielding member. Atleast a part of a noise generated by the communication circuit in adirection different from a radiation direction of the antenna module maybe passed through the electric shock prevention member, and a currentpassed through the electric shock prevention member may be reduced.

According to various embodiments of the disclosure, an antenna modulemay include a printed circuit board (PCB) having a first surface and asecond surface facing a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the first surface, a communication circuitdisposed on the second surface and electrically connected to the one ormore antennas, a shielding member surrounding at least in part thecommunication circuit, and an electric shock prevention memberpositioned to contact the shielding member. At least a part of a noisegenerated by the communication circuit in a direction different from aradiation direction of the antenna module may be passed through theelectric shock prevention member, and a current passed through theelectric shock prevention member may be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a block diagram of an electronic device in a networkenvironment according to an embodiment;

FIG. 2 is a block diagram of an electronic device for supporting alegacy network communication and a 5G network communication according toan embodiment;

FIG. 3A is a perspective view of a front surface of a mobile electronicdevice according to an embodiment;

FIG. 3B is a perspective view of a rear surface of the mobile electronicdevice in FIG. 3A;

FIG. 3C is an exploded perspective view of the mobile electronic devicein FIGS. 3A and 3B;

FIG. 4A are illustrations of a structure of a third antenna module inFIG. 2;

FIG. 4B is a cross-sectional view taken along a line Y-Y′ in FIG. 4A;

FIG. 5A is a perspective view of an antenna module according to anembodiment;

FIG. 5B is a cross-sectional view taken along a line 5B-5B in FIG. 5A;

FIG. 6A is an exploded perspective view of an antenna module and aconductive member applied thereto according to an embodiment;

FIG. 6B is a perspective view showing an antenna module and a conductivemember applied thereto according to an embodiment;

FIG. 7 is a cross-sectional view partially showing an electronic deviceincluding an antenna module with a conductive member applied accordingto an embodiment;

FIG. 8 is a cross-sectional view partially showing a thermallyconductive member for electric shock prevention shown in FIG. 7;

FIGS. 9, 10, 11, 12, and 13 are cross-sectional views each partiallyshowing an electronic device including an antenna module with aconductive member applied according to an embodiment; and

FIG. 14 is a cross-sectional view partially showing an electronic deviceincluding an antenna module according to an embodiment.

DETAILED DESCRIPTION

Embodiments of the disclosure are described below in detail withreference to the accompanying drawings.

FIG. 1 illustrates an electronic device in a network environmentaccording to an embodiment of the disclosure.

Referring to FIG. 1, an electronic device 101 in a network environment100 may communicate with an electronic device 102 via a first network198 (e.g., a short-range wireless communication network), or anelectronic device 104 or a server 108 via a second network 199 (e.g., along-range wireless communication network). The electronic device 101may communicate with the electronic device 104 via the server 108. Theelectronic device 101 includes a processor 120, memory 130, an inputdevice 150, an audio output device 155, a display device 160, an audiomodule 170, a sensor module 176, an interface 177, a haptic module 179,a camera module 180, a power management module 188, a battery 189, acommunication module 190, a subscriber identification module (SIM) 196,or an antenna module 197. In some embodiments, at least one (e.g., thedisplay device 160 or the camera module 180) of the components may beomitted from the electronic device 101, or one or more other componentsmay be added in the electronic device 101. in some embodiments, some ofthe components may be implemented as single integrated circuitry. Forexample, the sensor module 176 (e.g., a fingerprint sensor, an irissensor, or an illuminance sensor) may be implemented as embedded in thedisplay device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.As at least part of the data processing or computation, the processor120 may load a command or data received from another component (e.g.,the sensor module 176 or the communication module 190) in volatilememory 132, process the command or the data stored in the volatilememory 132, and store resulting data in non-volatile memory 134. Theprocessor 120 may include a main processor 121 (e.g., a centralprocessing unit (CPU) or an application processor (AP)), and anauxiliary processor 123 (e.g., a graphics processing unit (GPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. Additionally or alternatively, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display device 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). The auxiliaryprocessor 123 (e.g., an ISP or a CP) may be implemented as part ofanother component (e.g., the camera module 180 or the communicationmodule 190) functionally related to the auxiliary processor 123.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input device 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputdevice 150 may include, for example, a microphone, a mouse, a keyboard,or a digital pen (e.g., a stylus pen).

The audio output device 155 may output sound signals to the outside ofthe electronic device 101. The audio output device 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record, and the receivermay be used for an incoming call. The receiver may be implemented asseparate from, or as part of the speaker.

The display device 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display device 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. The display device 160 may include touchcircuitry adapted to detect a touch, or sensor circuitry (e.g., apressure sensor) adapted to measure the intensity of force incurred bythe touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. The audio module 170 may obtain the sound via the inputdevice 150, or output the sound via the audio output device 155 or aheadphone of an external electronic device (e.g., an electronic device102) directly (e.g., wiredly) or wirelessly coupled with the electronicdevice 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. The sensor module 176 may include, for example, agesture sensor, a gyro sensor, an atmospheric pressure sensor, amagnetic sensor, an acceleration sensor, a grip sensor, a proximitysensor, a color sensor, an infrared (IR) sensor, a biometric sensor, atemperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. The interface 177 may include, for example, a highdefinition multimedia interface (HDMI), a universal serial bus (USB)interface, a secure digital (SD) card interface, or an audio interface.

A connection terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). The connectionterminal 178 may include, for example, a HDMI connector, a USBconnector, a SD card connector, or an audio connector (e.g., a headphoneconnector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. The haptic module 179 may include, for example, a motor, apiezoelectric element, or an electric stimulator.

The camera module 180 may capture a still image or moving images. Thecamera module 180 may include one or more lenses, image sensors, ISPs,or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. The power management module 188 may beimplemented as at least part of, for example, a power managementintegrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. The battery 189 may include, for example, aprimary cell which is not rechargeable, a secondary cell which isrechargeable, or a fuel cell,

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more CPs that are operableindependently from the processor 120 (e.g., the AP) and supports adirect (e.g., wired) communication or a wireless communication. Thecommunication module 190 may include a wireless communication module 192(e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a cellular network, the Internet, or a computer network (e.g.,LAN or wide area network (WAN)). These various types of communicationmodules may be implemented as a single component (e.g., a single chip),or may be implemented as multi components (e.g., multi chips) separatefrom each other. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the SIM 196.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. The antenna module 197 may include an antennaincluding a radiating element composed of a conductive material or aconductive pattern formed in or on a substrate (e.g., a printed circuitboard (PCB)). The antenna module 197 may include a plurality ofantennas. In such a case, at least one antenna appropriate for acommunication scheme used in the communication network, such as thefirst network 198 or the second network 199, may be selected, forexample, by the communication module 190 (e.g., the wirelesscommunication module 192) from the plurality of antennas. The signal orthe power may then be transmitted or received between the communicationmodule 190 and the external electronic device via the selected at leastone antenna. Another component (e.g., a radio frequency integratedcircuit (RFIC)) other than the radiating element may be additionallyformed as part of the antenna module 197.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

Commands or data may be transmitted or received between the electronicdevice 101 and the external electronic device 104 via the server 108coupled with the second network 199. Each of the electronic devices 102and 104 may be a device of a same type as, or a different type, from theelectronic device 101. MI or some of operations to be executed at theelectronic device 101 may be executed at one or more of the externalelectronic devices 102, 104, or 108. For example, if the electronicdevice 101 should perform a function or a service automatically, or inresponse to a request from a user or another device, the electronicdevice 101, instead of, or in addition to, executing the function or theservice, may request the one or more external electronic devices toperform at least part of the function or the service. The one or moreexternal electronic devices receiving the request may perform the atleast part of the function or the service requested, or an additionalfunction or an additional service related to the request, and transferan outcome of the performing to the electronic device 101. Theelectronic device 101 may provide the outcome, with or without furtherprocessing of the outcome, as at least part of a reply to the request.To that end, a cloud computing, distributed computing, or client-servercomputing technology may be used, for example.

An electronic device according to an embodiment may be one of varioustypes of electronic devices. The electronic device may include aportable communication device (e.g., a smart phone), a computer device,a portable multimedia device, a portable medical device, a camera, awearable device, or a home appliance. However, the electronic device isnot limited to any of those described above.

Various embodiments of the disclosure and the terms used herein are notintended to limit the technological features set forth herein toparticular embodiments and include various changes, equivalents, orreplacements for a corresponding embodiment.

With regard to the description of the drawings, similar referencenumerals may be used to refer to similar or related elements.

A singular form of a noun corresponding to an item may include one ormore of the things, unless the relevant context clearly indicatesotherwise. As used herein, each of such phrases as “A or B”, “at leastone of A and B”, “at least one of A or B, or C”, “at least one of A, B,and C”, and “at least one of A, B, or C” may include any one of, or allpossible combinations of the items enumerated together in acorresponding one of the phrases.

As used herein, such terms as “1^(st)” and “2^(nd)”, or “first” and“second” may be used to simply distinguish a corresponding componentfrom another, and does not limit the components in other aspect (e.g.,importance or order). If an element (e.g., a first element) is referredto, with or without the term “operatively” or “communicatively”, as“coupled with”, “coupled to”, “connected with”, or “connected to”another element (e.g., a second element), it means that the element maybe coupled with the other element directly (e.g., wiredly), wirelessly,or via a third element.

The term “module” may include a unit implemented in hardware, software,or firmware, and may interchangeably be used with other terms, forexample, “logic”, “logic block”, “part”, or “circuitry”. A module may bea single integral component, or a minimum unit or part thereof, adaptedto perform one or more functions. For example, according to anembodiment, the module may be implemented in a form of anapplication-specific integrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

A method according to an embodiment of the disclosure may be includedand provided in a computer program product. The computer program productmay be traded as a product between a seller and a buyer. The computerprogram product may be distributed in the form of a machine-readablestorage medium (e.g., compact disc read only memory (CD-ROM)), or bedistributed (e.g., downloaded or uploaded) online via an applicationstore (e.g., PlayStore™), or between two user devices (e.g., smartphones) directly If distributed online, at least part of the computerprogram product may be temporarily generated or at least temporarilystored in the machine-readable storage medium, such as memory of themanufacturer's server, a server of the application store, or a relayserver.

Each component (e.g., a module or a program) of the above-describedcomponents may include a single entity or multiple entities. One or moreof the above-described components may be omitted, or one or more othercomponents may be added. Alternatively or additionally, a plurality ofcomponents (e.g., modules or programs) may be integrated into a singlecomponent. In such a case, the integrated component may still performone or more functions of each of the plurality of components in the sameor similar manner as they are performed by a corresponding one of theplurality of components before the integration. Operations performed bythe module, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

FIG. 2 is a block diagram illustrating an electronic device in a networkenvironment including a plurality of cellular networks according tovarious embodiments of the disclosure.

Referring to FIG. 2, the electronic device 101 may include a first CP212, second CP 214, first RFIC 222, second RFIC 224, third RFIC 226,fourth RFIC 228, first radio frequency front end (RFFE) 232, second RFFE234, first antenna module 242, second antenna module 244, and antenna248. The electronic device 101 may include a processor 120 and a memory130. A second network 199 may include a first cellular network 292 and asecond cellular network 294. According to another embodiment, theelectronic device 101 may further include at least one of the componentsdescribed with reference to FIG. 1, and the second network 199 mayfurther include at least one other network. According to one embodiment,the first CP 212, second CP 214, first RFIC 222, second MC 224, fourthRFIC 228, first RFFE 232, and second RFFE 234 may form at least part ofthe wireless communication module 192. According to another embodiment,the fourth RFIC 228 may be omitted or included as part of the third RFIC226.

The first CP 212 may establish a communication channel of a band to beused for wireless communication with the first cellular network 292 andsupport legacy network communication through the establishedcommunication channel. According to various embodiments, the firstcellular network may be a legacy network including a second generation(2G), 3G, 4G, or long term evolution (LTE) network. The second CP 214may establish a communication channel corresponding to a designated band(e.g., about 6 GHz to about 60 GHz) of bands to be used for wirelesscommunication with the second cellular network 294, and support 5Gnetwork communication through the established communication channel.According to various embodiments, the second cellular network 294 may bea 5G network defined in 3GPP. Additionally, according to an embodiment,the first CP 212 or the second CP 214 may establish a communicationchannel corresponding to another designated band (e.g., about 6 GHz orless) of bands to be used for wireless communication with the secondcellular network 294 and support 5G network communication through theestablished communication channel. According to one embodiment, thefirst CP 212 and the second CP 214 may be implemented in a single chipor a single package. According to various embodiments, the first CP 212or the second CP 214 may be formed in a single chip or a single packagewith the processor 120, the auxiliary processor 123, or thecommunication module 190.

Upon transmission, the first RFIC 222 may convert a baseband signalgenerated by the first CP 212 to a radio frequency (RF) signal of about700 MHz to about 3 GHz used in the first cellular network 292 (e.g.,legacy network). Upon reception, an RF signal may be obtained from thefirst cellular network 292 (e.g., legacy network) through an antenna(e.g., the first antenna module 242) and be preprocessed through an RFFE(e.g., the first RFFE 232). The first RFIC 222 may convert thepreprocessed RF signal to a baseband signal so as to be processed by thefirst CP 212.

Upon transmission, the second RFIC 224 may convert a baseband signalgenerated by the first CP 212 or the second CP 214 to an RF signal(hereinafter, 5G Sub6 RF signal) of a Sub6 band (e.g., 6 GHz or less) tobe used in the second cellular network 294 (e.g., 5G network). Uponreception, a 5G Sub6 RF signal may be obtained from the second cellularnetwork 294 (e.g., 5G network) through an antenna (e.g., the secondantenna module 244) and be pretreated through an RFFE (e.g., the secondRFFE 234). The second RFIC 224 may convert the preprocessed 5G Sub6 RFsignal to a baseband signal so as to be processed by a corresponding CPof the first CP 212 or the second CP 214.

The third RFIC 226 may convert a baseband signal generated by the secondCP 214 to an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6band (e.g., about 6 GHz to about 60 GHz) to be used in the secondcellular network 294 (e.g., 5G network). Upon reception, a 5G Above6 RFsignal may be obtained from the second cellular network 294 (e.g., 5Gnetwork) through an antenna (e.g., the antenna 248) and he preprocessedthrough the third RFFE 236. The third RFIC 226 may convert thepreprocessed 5G Above6 RF signal to a baseband signal so as to beprocessed by the second CP 214, According to one embodiment, the thirdRFFE 236 may be formed as part of the third RFIC 226.

According to an embodiment, the electronic device 101 may include afourth RFIC 228 separately from the third RFIC 226 or as at least partof the third RFIC 226. In this case, the fourth RFIC 228 may convert abaseband signal generated by the second CP 214 to an RF signal(hereinafter, an intermediate frequency (IF) signal) of an intermediatefrequency band (e.g., about 9 GHz to about 11 GHz) and transfer the IFsignal to the third RFIC 226. The third RFIC 226 may convert the IFsignal to a 5G Above 6RF signal. Upon reception, the 5G Above 6RF signalmay be received from the second cellular network 294 (e.g., a 5Gnetwork) through an antenna (e.g., the antenna 248) and be converted toan IF signal by the third RFIC 226. The fourth RFIC 228 may convert anIF signal to a baseband signal so as to be processed by the second CP214.

According to one embodiment, the first RFIC 222 and the second RFIC 224may be implemented into at least part of a single package or a singlechip. According to one embodiment, the first RFFE 232 and the secondRFFE 234 may be implemented into at least part of a single package or asingle chip. According to one embodiment, at least one of the firstantenna module 242 or the second antenna module 244 may be omitted ormay be combined with another antenna module to process RF signals of acorresponding plurality of bands.

According to one embodiment, the third RFIC 226 and the antenna 248 maybe disposed at the same substrate to form a third antenna module 246.For example, the wireless communication module 192 or the processor 120may be disposed at a first substrate (e.g., main PCB). In this case, thethird WIC 226 is disposed in a partial area (e.g., lower surface) of thefirst substrate and a separate second substrate (e.g., sub PCB), and theantenna 248 is disposed in another partial area (e.g., upper surface)thereof; thus, the third antenna module 246 may be formed. By disposingthe third RFIC 226 and the antenna 248 in the same substrate, a lengthof a transmission line therebetween can be reduced. This may reduce, forexample, a loss (e.g., attenuation) of a signal of a high frequency band(e.g., about 6 GHz to about 60 GHz) to be used in 5G networkcommunication by a transmission line. Therefore, the electronic device101 may improve a quality or speed of communication with the secondcellular network 294 (e.g., 5G network).

According to one embodiment, the antenna 248 may be formed in an antennaarray including a plurality of antenna elements that may be used forbeamforming. In this case, the third RFIC 226 may include a plurality ofphase shifters 238 corresponding to a plurality of antenna elements, forexample, as part of the third RFFE 236. Upon transmission, each of theplurality of phase shifters 238 may convert a phase of a 5G Above6 RFsignal to be transmitted to the outside (e.g., a base station of a 5Gnetwork) of the electronic device 101 through a corresponding antennaelement. Upon reception, each of the plurality of phase shifters 238 mayconvert a phase of the 5G Above6 RF signal received from the outside tothe same phase or substantially the same phase through a correspondingantenna element. This enables transmission or reception throughbeamforming between the electronic device 101 and the outside.

The second cellular network 294 (e.g., 5G network) may operate (e.g.,stand-alone (SA)) independently of the first cellular network 292 (e.g.,legacy network) or may be operated (e.g., non-stand alone (NSA)) inconnection with the first cellular network 292. For example, the 5Gnetwork may have only an access network (e.g., 5G radio access network(RAN) or a next generation (NG) RAN and have no core network (e.g., nextgeneration core (NGC)). In this case, after accessing to the accessnetwork of the 5G network, the electronic device 101 may access to anexternal network (e.g., Internet) under the control of a core network(e.g., an evolved packed core (EPC)) of the legacy network. Protocolinformation (e.g., LTE protocol information) for communication with alegacy network or protocol information (e.g., new radio (NR) protocolinformation) for communication with a 5G network may be stored in thememory 130 to be accessed by other components (e.g., the processor 120,the first CP 212, or the second GP 214).

FIG. 3A is a front perspective view illustrating a mobile electronicdevice 300 according to an embodiment.

FIG. 3B is a rear perspective view illustrating a mobile electronicdevice 300 according to an embodiment.

Referring to FIGS. 3A and 3B, the mobile electronic device 300 (e.g.,the electronic device 101 of FIG. 1) according to various embodimentsmay include a housing 310 including a first surface (or front surface)310A, a second surface (or rear surface) 310B, and a side surface 310Cenclosing a space between the first surface 310A and the second surface310B. In one embodiment, the housing may refer to a structure formingsome of the first surface 310A, the second surface 310B, and the sidesurface 310C. According to one embodiment, the first surface 310A may beformed by an at least partially substantially transparent front plate302 (e g., a polymer plate or a glass plate including various coatinglayers). The second surface 310B may be formed by a substantially opaquerear plate 311. The rear plate 311 may be formed by, for example, coatedor colored glass, ceramic, polymer, metal (e.g., aluminum, stainlesssteel (STS or SUS), or magnesium), or a combination of at least two ofthe above materials. The side surface 310C may be coupled to the frontplate 302 and the rear plate 311 and be formed by a side bezel structure(or “side member”) 318 including a metal and/or a polymer. In someembodiments, the rear plate 311 and the side bezel structure 318 may beintegrally formed and include the same material (e.g., metal materialsuch as aluminum).

In the illustrated embodiment, the front plate 302 may include two firstregions 310D bent and extended seamlessly from the first surface 310Atoward the rear plate 311 at both ends of a long edge of the front plate302. In the illustrated embodiment (see FIG. 3B), the rear plate 311 mayinclude two second regions 310E bent and extended seamlessly from thesecond surface 310B towards the front plate 302 at both ends of a longedge. In some embodiments, the front plate 302 (or the rear plate 311)may include only one of the first regions 310D (or the second regions310E). In one embodiment, a portion of the first regions 310D or thesecond regions 310E may not be included. In the above embodiments, whenviewed from the side surface of the mobile electronic device 300, theside bezel structure 318 may have a first thickness (or width) at a sidesurface in which the first region 310D or the second region 310E is notincluded and have a second thickness smaller than the first thickness ata side surface including the first region 310D or the second region310E.

According to one embodiment, the mobile electronic device 300 mayinclude at least one of a display 301; audio modules 303, 307, and 314;sensor modules 304, 316, and 319; camera modules 305, 312, and 313; keyinput device 317; light emitting element 306; and connector holes 308and 309. In some embodiments, the mobile electronic device 300 may omitat least one (e.g., the key input device 317 or the light emittingelement 306) of the components or may further include other components.

The display 301 may be exposed through, for example, a substantialportion of the front plate 302. In some embodiments, at least part ofthe display 301 may be exposed through the front plate 302 forming thefirst region 310D of the side surface 310C and the first surface 310A.In some embodiments, an edge of the display 301 may be formed to besubstantially the same as an adjacent outer edge shape of the frontplate 302. In one embodiment, in order to enlarge an area Where thedisplay 301 is exposed, a distance between an outer edge of the display301 and an outer edge of the front plate 302 may be formed to besubstantially the same.

In an embodiment, in a portion of a screen display area of the display301, a recess or an opening may be formed, and at least one of the audiomodule 314 and the sensor module 304, the camera module 305, and thelight emitting element 306 aligned with the recess or the opening may beincluded. In one embodiment, at a rear surface of a screen display areaof the display 301, at least one of the audio module 314, the sensormodule 304, the camera module 305, the fingerprint sensor module 316,and the light emitting element 306 may be included. In one embodiment,the display 301 may be coupled to or disposed adjacent to a touchdetection circuit, a pressure sensor capable of measuring intensity(pressure) of the touch, and/or a digitizer for detecting a stylus penof a magnetic field method. In some embodiments, at least part of thesensor modules 304 and 319 and/or at least part of the key input device317 may be disposed in a first region 310D and/or a second region 310E.

The audio modules 303, 307, and 314 may include a microphone hole 303and speaker holes 307 and 314. The microphone hole 303 may dispose amicrophone for obtaining an external sound therein; and, in someembodiments, a plurality of microphones may be disposed to detect adirection of a sound. The speaker holes 307 and 314 may include anexternal speaker hole 307 and a call receiver hole 314. In someembodiments, the speaker holes 307 and 314 and the microphone hole 303may be implemented into one hole, or the speaker may be included withoutthe speaker holes 307 and 314 (e.g., piezo speaker).

The sensor modules 304, 316, and 319 may generate an electrical signalor a data value corresponding to an operating state inside the mobileelectronic device 300 or an environment state outside the mobileelectronic device 300. The sensor modules 304, 316, and 319 may include,for example, a first sensor module 304 (e.g., proximity sensor) and/or asecond sensor module (e.g., fingerprint sensor), disposed at the firstsurface 310A of the housing 310, and/or a third sensor module 319 (e.g.,a heart rate monitor (HRM) sensor) and/or a fourth sensor module 316(e.g., fingerprint sensor), disposed at the second surface 310B of thehousing 310. The fingerprint sensor may be disposed at the secondsurface 310B as well as the first surface 310A (e.g., the display 301)of the housing 310. The mobile electronic device 300 may further includea sensor module, for example, at least one of a gesture sensor, gyrosensor, air pressure sensor, magnetic sensor, acceleration sensor, gripsensor, color sensor, IR sensor, biometric sensor, temperature sensor,humidity sensor, and illumination sensor 304.

The camera modules 305, 312, and 313 may include a first camera device305 disposed at the first surface 310. A of the mobile electronic device300, a second camera device 312 disposed at the second surface 31013thereof, and/or a flash 313. The camera modules 305 and 312 may includeone or a plurality of lenses, an image sensor, and/or an ISP. The flash313 may include, for example, a light emitting diode or a xenon lamp. Insome embodiments, two or more lenses (infrared camera, wide angle andtelephoto lens) and image sensors may be disposed at one surface of themobile electronic device 300.

The key input device 317 may be disposed at the side surface 310C of thehousing 310. In one embodiment, the mobile electronic device 300 may notinclude some or all of the above-described key input devices 317, andthe key input device 317 that is not included may be implemented inother forms such as a soft key on the display 301. In some embodiments,the key input device 317 may include a sensor module 316 disposed at thesecond surface 310B of the housing 310.

The light emitting element 306 may be disposed at, for example, thefirst surface 310A of the housing 310. The light emitting element 306may provide, for example, status information of the mobile electronicdevice 300 in an optical form. In one embodiment, the light emittingelement 306 may provide, for example, a light source interworking withan operation of the camera module 305. The light emitting element 306may include, for example, a light emitting diode (LED), an IR LED, and axenon lamp.

The connector ports 308 and 309 may include a first connector port 308that may receive a connector (e.g., a USB connector) for transmittingand receiving power and/or data to and from an external electronicdevice and/or a second connector hole (e.g., earphone jack) 309 that canreceive a connector for transmitting and receiving audio signals to andfrom an external electronic device.

FIG. 3C is an exploded perspective view illustrating a mobile electronicdevice according to an embodiment.

Referring to FIG. 3C, the mobile electronic device 320 (e.g., the mobileelectronic device 300 of FIG. 3A) may include a side bezel structure321, first support member 3211 (e.g., bracket), front plate 322, display323, printed circuit board 324, battery 325, second support member 326(e.g., rear case), antenna 327, and rear plate 328. In some embodiments,the electronic device 320 may omit at least one (e.g., the first supportmember 3211 or the second support member 326) of the components or mayfurther include other components. At least one of the components of theelectronic device 320 may be the same as or similar to at least one ofthe components of the mobile electronic device 300 of FIG. 3A or 3B anda duplicated description is omitted below.

The first support member 3211 may be disposed inside the electronicdevice 320 to be connected to the side bezel structure 321 or may beintegrally formed with the side bezel structure 321. The first supportmember 3211 may be made of, for example, a metal material and/or anon-metal (e.g., polymer) material. In the first support member 3211,the display 323 may be coupled to one surface thereof, and the printedcircuit board 324 may be coupled to the other surface thereof. In theprinted circuit board 324, a processor, a memory, and/or an interfacemay be mounted. The processor may include, for example, one or more of aCPU, AP, GPU, ISP, sensor hub processor, or CP.

The memory may include, for example, a volatile memory or a nonvolatilememory.

The interface may include, for example, a HDMI, a USB interface, SD cardinterface, and/or audio interface. The interface may, for example,electrically or physically connect the electronic device 320 to anexternal electronic device and include a USB connector, an SDcard/multimedia card (MMC) connector, or an audio connector.

The battery 325 is a device for supplying power to at least onecomponent of the electronic device 320 and may include, for example, anon-rechargeable primary battery, a rechargeable secondary battery, or afuel cell. At least part of the battery 325 may be disposed, forexample, on substantially the same plane as that of the printed circuitboard 324, The battery 325 may be integrally disposed inside theelectronic device 320 or may be detachably disposed in the electronicdevice 320.

The antenna 327 may be disposed between the rear plate 328 and thebattery 325. The antenna 327 may include, for example, a near fieldcommunication (NFC) antenna, wireless charging antenna, and/or magneticsecure transmission (MST) antenna. The antenna 327 may perform, forexample, short range communication with an external device or maywirelessly transmit and receive power required for charging. In oneembodiment, an antenna structure may be formed by some or a combinationof the side bezel structure 321 and/or the first support member 3211.

FIG. 4A is a diagram illustrating a structure of for example, a thirdantenna module described with reference to FIG. 2 according to anembodiment.

Referring to FIG. 4A(a) is a perspective view illustrating the thirdantenna module 246 viewed from one side, and FIG. 4A(b) is a perspectiveview illustrating the third antenna module 246 viewed from the otherside. FIG. 4A(c) is a cross-sectional view illustrating the thirdantenna module 246 taken along line X-X′ of FIG. 4A.

With reference to FIG. 4A, in one embodiment, the third antenna module246 may include a printed circuit board 410, an antenna array 430, aRFIC 452, and a PMIC 454. Alternatively, the third antenna module 246may further include a shield member 490. In other embodiments, at leastone of the above-described components may be omitted or at least two ofthe components may be integrally formed.

The printed circuit board 410 may include a plurality of conductivelayers and a plurality of non-conductive layers stacked alternately withthe conductive layers. The printed circuit board 410 may provideelectrical connections between the printed circuit board 410 and/orvarious electronic components disposed outside using wirings andconductive vias formed in the conductive layer.

The antenna array 430 (e.g., 248 of FIG. 2) may include a plurality ofantenna elements 432, 434, 436, or 438 disposed to form a directionalbeam. As illustrated, the antenna elements 432, 434, 436, or 438 may beformed at a first surface of the printed circuit board 410. According toanother embodiment, the antenna array 430 may be formed inside theprinted circuit board 410. According to the embodiment, the antennaarray 430 may include the same or a different shape or kind of aplurality of antenna arrays (e.g., dipole antenna array and/or patchantenna array).

The RFIC 452 (e.g., the third RFIC 226 of FIG. 2) may be disposed atanother area (e.g., a second surface opposite to the first surface) ofthe printed circuit board 410 spaced apart from the antenna array. TheRFIC 452 is configured to process signals of a selected frequency bandtransmitted/received through the antenna array 430. According to oneembodiment, upon transmission, the RFIC 452 may convert a basebandsignal obtained from a CP to an RF signal of a designated band. Uponreception, the RFIC 452 may convert an RF signal received through theantenna array 430 to a baseband signal and transfer the baseband signalto the CP.

According to another embodiment, upon transmission, the RFIC 452 mayup-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtainedfrom an intermediate frequency integrated circuit (IFIC) (e.g., 228 ofFIG. 2) to an RF signal of a selected band. Upon reception, the RFIC 452may down-convert the RF signal obtained through the antenna array 430,convert the RF signal to an IF signal, and transfer the IF signal to theIFIC.

The PMIC 454 may be disposed in another partial area (e.g., the secondsurface) of the printed circuit hoard 410 spaced apart from the antennaarray 430. The PMIC 454 may receive a voltage from a main PCB to providepower necessary for various components (e.g., the RFIC 452) on theantenna module.

The shielding member 490 may be disposed at a portion (e.g., the secondsurface) of the printed circuit board 410 so as to electromagneticallyshield at least one of the RFIC 452 or the PMIC 454. According to oneembodiment, the shield member 490 may include a shield can.

In various embodiments, the third antenna module 246 may be electricallyconnected to another printed circuit board (e.g., main circuit board)through a module interface. The module interface may include aconnecting member, for example, a coaxial cable connector, board toboard connector, interposer, or flexible printed circuit board (FPCB).The RFIC 452 and/or the PMIC 454 of the antenna module may beelectrically connected to the printed circuit board through theconnection member.

FIG. 4B is a cross-sectional view illustrating the third antenna module246 taken along line Y-Y′ of FIG. 4A(a) according to various embodimentsof the disclosure. The printed circuit board 410 of the illustratedembodiment may include an antenna layer 411 and a network layer 413

With reference to FIG. 4B, the antenna layer 411 may include at leastone dielectric layer 437-1, and an antenna element 436 and/or a powerfeeding portion 425 formed on or inside an outer surface of a dielectriclayer. The power feeding portion 425 may include a power feeding point427 and/or a power feeding line 429.

The network layer 413 may include at least one dielectric layer 437-2,at least one ground layer 433, at least one conductive via 435, atransmission line 423, and/or a power feeding line 429 formed on orinside an outer surface of the dielectric layer.

Further, in the illustrated embodiment, the RFIC 452 (e.g., the thirdRFIC 226 of FIG. 2) of FIG. 4A(c) may be electrically connected to thenetwork layer 413 through, for example, first and second solder bumps440-1 and 440-2. In other embodiments, various connection structures(e.g., solder or ball grid array (BGA)) instead of the solder bumps maybe used. The RFIC 452 may be electrically connected to the antennaelement 436 through the first solder bump 440-1, the transmission line423, and the power feeding portion 425. The RFIC 452 may also beelectrically connected to the ground layer 433 through the second solderbump 440-2 and the conductive via 435. The RFIC 452 may also beelectrically connected to the above-described module interface throughthe power feeding line 429.

FIG. 5A is a perspective view of an antenna module 500 according to anembodiment. FIG. 5B is a cross-sectional view taken along the line B-B′in FIG. 5A

Referring to FIGS. 5A and 5B, the antenna module 500 may be similar, atleast in part, to the third antenna module 246 of FIG. 2, or may includeother embodiments of the antenna module 500.

The antenna module 500 may include, as an antenna element, an antennaarray ARI composed of a plurality of conductive patches 510, 520, 530,and 540. The plurality of conductive patches 510, 520, 530, and 540 maybe formed on a printed circuit board (PCB) 590. The PCB 590 may have afirst surface 591 facing a first direction (indicated by {circle around(1)}and a second surface 592 facing a second direction (indicated by{circle around (2)}) opposite to the first direction. The antenna module500 may include a wireless communication circuit 595 disposed on thesecond surface 592 of the PCB 590. The plurality of conductive patches510, 520, 530, and 540 may be electrically connected to the wirelesscommunication circuit 595. The wireless communication circuit 595 may beconfigured to transmit and/or receive a radio frequency signal in therange of about 3 GHz to 100 GHz via the antenna array AR1.

The plurality of conductive patches 510, 520, 530, and 540 may include afirst conductive patch 510, a second conductive patch 520, a thirdconductive patch 530, and a fourth conductive patch 540 which aredisposed at regular intervals on the first surface 591 of the PCB 590 ornear the first surface 591 in the PCB 590. The conductive patches 510,520, 530, 540 may have substantially the same configuration. Althoughthe antenna module 500 is illustrated and described as including theantenna array AR1 composed of four conductive patches 510, 520, 530, and540, this is exemplary only and is not intended to be construed as alimitation. Alternatively, the antenna module 500 may include, as theantenna array AR1, one, two, three, five, or more conductive patches.The antenna module 500 may further include a plurality of conductivepatterns (e.g., a dipole antenna) disposed on the PCB 590. In this case,the conductive patterns may be arranged to form a beam pattern directiondifferent from (e.g., perpendicular to) a beam pattern direction of theconductive patches 510, 520, 530, and 540.

The antenna module 500 may include a protective member 593 disposed onthe second surface 592 of the PCB 590 to surround at least partially thewireless communication circuit 595. The protective member 593 is anencapsulation layer for covering the wireless communication circuit 595and may be formed of a dielectric material that is coated and then curedand/or solidified. The protective member 593 may be formed of an epoxyresin. The protective member 593 may be disposed to surround all or partof the wireless communication circuit 595 on the second surface 592 ofthe PCB 590. The antenna module 500 may include a conductive shieldinglayer 594 coated on a surface of the protective member 593. Theconductive shielding layer 594 may shield noise (e.g., direct current(DC) to DC (DC-DC) noise or an interference frequency component),generated at the antenna module 500, from being spread to thesurroundings. The conductive shielding layer 594 may be formed of aconductive material coated on the surface of the protective member 593by a thin film deposition method such as sputtering. The conductiveshielding layer 594 may he electrically connected to a ground of the PCB590. The protective member 593 and/or the conductive shielding layer 594may be replaced with a shield can mounted on the PCB 590.

The antenna module 500 operating in a relatively high frequency hand maygenerate noise (e.g., DC-DC noise or an interference frequencycomponent). Such noise may be delivered to a certain structure (e.g., alegacy antenna module or a display) disposed around the antenna module500, thereby causing performance degradation of the structure. Thus, inaddition to the above-described conductive shielding layer 594, anenhanced shielding structure (e.g., an enhanced ground structure) may befurther required. Moreover, the antenna module 500, which generatesrelatively high heat, may also require an improved heat dissipationstructure.

An antenna module having an enhanced and improved shielding and heatdissipation structure is described below through various embodiments. Inaddition, an electronic device including the antenna module 500 isdescribed below.

FIG. 6A is an exploded perspective view of the antenna module 500 and aconductive member 550 applied thereto according to an embodiment. FIG.6B is a perspective view of the antenna module 500 and the conductivemember 550 applied thereto according to an embodiment.

Referring to FIGS. 6A and 6B, an electronic device (e.g., the electronicdevice 700 in FIG. 7 described below) may include the conductive member550 fixed, at least in part, to the antenna module 500, and a thermallyconductive member 560 disposed between the conductive member 550 and theantenna module 500 to prevent electric shock. The conductive member 550may be fixed to a conductive portion (e.g., the conductive portion 721in FIG. 7 described below) of a housing (e.g., the housing 710 in FIG. 7described below) of the electronic device and/or to a conductive portionof a support member (e.g., the support member 711 in FIG. 7 describedbelow). The conductive member 550 may be in physical contact with aconductive portion of a lateral member (e.g., the lateral member 720 inFIG. 7) to thereby reinforce the rigidity of the antenna module 500. Theconductive member 550 may be formed of a metal material such asstainless steel (SUS), copper (Cu), or aluminum (Al) to effectivelyconduct a high-temperature heat emitted from the antenna module 500 tothe outside. The conductive member 550 may be electrically connected tothe conductive shielding layer 594 of the antenna module 500, therebyenhancing shielding against noise.

The conductive member 550 may include a first support part 551 facing,at least in part, (e.g., facing the lateral surface of) the PCB 590 ofthe antenna module 500, and a second support part 552 extended from thefirst support part 551 and bent to face the conductive shielding layer594. The conductive member 550 may include at least one extension part5511 and 5512 extended from at least one end of the first support part551 and fixed to the conductive portion of the housing and/or to theconductive portion of the support member. The at least one extensionpart 5511 and 5512 may include a pair extended in opposite directions ofthe conductive member 550. The at least one extension part 5511 and 5512may be extended from the second support part 552. Therefore, the antennamodule 500 may be supported by the first support part 551 and the secondsupport part 552 of the conductive member 550 and fixed to theconductive portion (of the housing and/or to the described belowconductive portion of the support member through the at least oneextension part 5511 and 5512 by a fastening member such as a screw.

The conductive member 550 may be attached to the conductive shieldinglayer 594 of the antenna module 500 through the thermally conductivemember 560 for electric shock prevention. The conductive member 550 maybe connected to have an alternating current (AC) ground structure havingcapacitance with the conductive shielding layer 594 of the antennamodule 500 through the thermally conductive member 560 for electricshock prevention. This makes it possible to prevent an electric shockissue that may be caused when the conductive member 550 comes in contactwith a conductive portion forming, at least in part, the appearance ofthe electronic device.

The electronic device may further include another thermally conductivemember 570 disposed between the conductive member 550 and the conductiveportion. The thermally conductive member 570 may be formed of athermally conductive tape or a thermal interface material (TIM).

FIG. 7 is a cross-sectional view partially showing the electronic device700 including the antenna module 500 with the conductive member 560applied according to an embodiment.

Referring to FIG. 7, the electronic device 700 may be similar, at leastin part, to the electronic device 101 of FIG. 1 or the electronic device300 of FIG. 3A, or may include other embodiments of the electronicdevice 700.

The electronic device 700 may include the housing 710 that includes afront plate 730 (e.g., a first plate) facing a first direction (e.g.,the −Z direction), a rear plate 740 (e.g., a second plate) facing adirection (e.g., the Z direction) opposite to the front plate 730, andthe lateral member 720 surrounding an inner space 7001 between the frontplate 730 and the rear plate 740. The lateral member 720 may include theconductive portion 721 disposed at least in part and a polymer portion722 (i.e., a non-conductive portion) insert-injected into the conductiveportion 721. The polymer portion 722 may be replaced with a space or anyother dielectric material. The polymer portion 722 may be structurallycombined with the conductive portion 721. The lateral member 720 mayinclude the support member 711 extended partially into the inner space7001. The support member 711 may be extended from the lateral member 720into the inner space 7001 or formed by a structural combination with thelateral member 720. The support member 711 may be extended from theconductive portion 721. The support member 711 may support at least aportion of the antenna module 500 disposed in the inner space 7001. Thesupport member 711 may be disposed to support at least a portion of adisplay 750. The display 750 may be disposed to be visible from theoutside through at least a portion of the front plate 730.

The antenna module 500 may be disposed in a direction perpendicular tothe front plate 730 in the inner space 7001 of the electronic device700. The antenna module 500 may be mounted such that the antenna arrayAR1 including the conductive patches 510, 520, 530, and 540 faces thelateral member 720. For example, the antenna module 500 may be mountedinto a module mounting portion 7201 provided in the lateral member 720such that the first surface 591 of the PCB 590 faces the lateral member720. At least a portion of the lateral member 720 facing the antennamodule 500 may be formed as the polymer portion 722 such that a beampattern is formed in a direction (denoted by an arrow in FIG. 7) of thelateral member 720. The electronic device 700 may include a devicesubstrate 760 (e.g., a main substrate) disposed in the inner space 7001.The antenna module 500 may be electrically connected to the devicesubstrate 760 through an electrical connection member (e.g., an FPCBconnector).

The electronic device 700 may include the conductive member 550 disposedon at least a portion of the antenna module 500. The conductive member550 may be formed in various shapes depending on a shape of the antennamodule 500 or a mounting structure of the antenna module 500 on thelateral member 720. At least a portion of the conductive member 550 maybe disposed to face, at least in part, the conductive shielding layer594 formed in a direction of the second surface 592 of the PCB 590. Atleast a portion of the conductive member 550 may be disposed to face theconductive portion 721 of the lateral member 720. For example, at leasta portion of the conductive member 550 may be disposed to face theconductive portion 721 in the module mounting portion 7201. According toan embodiment, the conductive shielding layer 594 may include a firstending portion 5941 and a second ending portion 5942. The first endingportion 5941 and the second ending portion 5942 may be extended tocontact the second surface 592 in a direction (denoted by an arrow inFIG. 7) where the lateral member 720 faces.

The electronic device 700 may include the thermally conductive member560 for electric shock prevention interposed between the conductivemember 550 and the conductive shielding layer 594. The thermallyconductive member 560 for electric shock prevention may have a tapeform. The thermally conductive member 560 for electric shock preventionmay connect the conductive member 550 and the conductive shielding layer594 of the antenna module 500 to have an AC ground structure havingcapacitance, thereby preventing electric shock caused by a physicalcontact between the conductive member 550 and the conductive portion721. The thermally conductive member 560 for electric shock preventionmay not only connect the conductive member 550 and the conductiveshielding layer 594 to have an AC ground structure, but also deliver ahigh-temperature heat generated from the antenna module 500 to theconductive member 550 by including a thermally conductive material. Theelectronic device 700 may also include another thermally conductivemember 570 disposed between the conductive member 550 and the conductiveportion 721 of the lateral member 720. The thermally conductive member570 may be formed of a thermally conductive tape or a TIM, and mayinduce an effective heat dissipation by delivering a heat, transferredfrom the antenna module 500 to the conductive member 550, to theconductive portion 721 of the lateral member 720 and/or the supportmember 711.

The conductive member 550 may not only effectively shield a noisegenerated from the antenna module 500, but also deliver ahigh-temperature heat generated from the antenna module 500 to asurrounding conductive structure (e.g., the conductive portion 721 orthe conductive support member 711). In some embodiments, the conductivemember 550 may be replaced with a conductive structure which extendsfrom the conductive portion 721 and formed of a structure for supportingthe antenna module.

FIG. 8 is a cross-sectional view partially showing the thermallyconductive member 560 for electric shock prevention shown in FIG 7.

Referring to FIG. 8, the thermally conductive member 560 for electricshock prevention may include a first layer 561 facing the conductivemember 550, a second layer 562 facing the conductive shielding layer 594of the antenna module 500, and a third layer 563 interposed between thefirst layer 561 and the second layer 562 and containing a plurality ofceramic fillers 564. Each of the first layer 561 and the second layer562 may be formed of an anisotropic conductive film (ACE) configured tohave conductivity in one direction in response to a pressure. The thirdlayer 563 may be formed of a dielectric material such as an epoxy resin.The ceramic filler 564 may be formed in a ball shape having a highdielectric constant and a high thermal conductivity. The ceramic filler564 may be formed in various shapes.

The first layer 561 and the second layer 562 may have a specificcapacitance (e.g., about 40 pF to about 60 pF) through the third layer563. When the conductive member 550 is attached to the conductiveshielding layer 594 of the antenna module 500 through the thermallyconductive member 560 for electric shock prevention, the first layer 561and the second layer 562 may be converted into a conductor by a certainpressure (e.g., a pressure for attachment), and the thermally conductivemember 560 for electric shock prevention may have an AC ground structurehaving a specific capacitance value through the third layer 563. Forexample, the thermally conductive member 560 for electric shockprevention, together with the conductive shielding layer 594, mayexhibit an improved effect of shielding noise generated from the antennamodule 500, and also prevent an electric shock that can be generatedthrough the conductive portion of the housing 710. The thermallyconductive member 560 for electric shock prevention may transfer a heatemitted from the antenna module 500 to the conductive member through theceramic filler 564 filled in the third layer 563.

FIGS. 9 to 13 are cross-sectional views each partially showingelectronic devices 900, 1000, 1100, 1200, and 1300, respectively,including the antenna module 500 with a conductive member appliedaccording to an embodiment.

Referring to FIGS. 9 to 13, each of electronic devices 900, 1000, 1100,1200, and 1300 may be similar, at least in part, to the electronicdevice 101 of FIG. 1 or the electronic device 300 of FIG. 3A, or mayinclude other embodiments of the electronic device.

In describing the electronic devices of the disclosure, the samecomponents as those of the electronic device 700 shown in FIG. 7 aredenoted by the same reference numerals, and, thus, detailed descriptionsthereof are omitted here.

Referring to FIG. 9, the electronic device 900 may include a conductivemember 950 that is attached to the conductive shielding layer 594 of theantenna module 500 and is physically and electrically connected to theground layer 762 of the device substrate 760 and to a separate vaporchamber 910 disposed in the inner space 7001 of the electronic device900. The conductive member 950 may be disposed in the inner space 7001of the electronic device 900 and formed of at least one of Cu, Al, orSUS in a plate type.

The device substrate 760 may include a first substrate surface 7601facing the rear plate 740 and a second substrate surface 7602 facing ina direction opposite to the first substrate surface 7601. The devicesubstrate 760 may be disposed substantially parallel with the rear plate740. The device substrate 760 may be disposed in various ways of notbeing parallel with the rear plate 740 in view of mounting efficiency.The conductive member 950 may include a first portion 951 connected tothe conductive shielding layer 594 of the antenna module 500 through afirst thermally conductive member 921, a second portion 952 extendedfrom the first portion 951 and being in contact with the ground pad 761electrically connected to the ground layer 762 of the device substrate760 and exposed to the first substrate surface 7601, a third portion 953extended from the second portion 952 toward the vapor chamber 910,and/or a fourth portion 954 extended from the third portion 953 andconnected to the vapor chamber 910 through a second thermally conductivemember 922. Although each of the second portion 952, the third portion953, and the fourth portion 954 sequentially extended from the firstportion 951 of the conductive member 950 is shown in a shape of beingbent at a right angle, this is exemplary only. Alternatively, at leastone of the second portion 952, the third portion 953, and the fourthportion 954 may be bent at various angles rather than at a right angleor bent to have a curved shape. The second portion 952 may beelectrically connected to the ground pad 761 of the device substrate 760through at least one of a screw, soldering, conductive bonding, aconductive tape, a conductive sponge, or a conductive clip. Each of thefirst thermally conductive member 921 and the second thermallyconductive member 922 may be formed of at least one of a conductivetape, a conductive TIM, or a conductive sponge having excellent thermalconductivity.

The noise emitted from the antenna module 500 may be shielded by aground structure extended through the first portion 951 and the secondportion 952 of the conductive member 950 electrically connected from theconductive shielding layer 594 to the ground layer 762 of the devicesubstrate 760. High-temperature heat emitted from the antenna module 500may be dissipated to both the ground layer 762 of the device substrate760 and the vapor chamber 910 through the first portion 951, the secondportion 952, the third portion 953, and the fourth portion 954 of theconductive member 950.

Referring to FIG. 10, the electronic device 1000 may include aplate-type conductive member 1050 that is attached to the conductiveshielding layer 594 of the antenna module 500 and is physically andelectrically connected to the ground layer 762 of the device substrate760 and to the vapor chamber 910 disposed in the inner space 7001 of theelectronic device 900. The conductive member 1050 may include a firstportion 1051 connected to the conductive shielding layer 594 of theantenna module 500 through the first thermally conductive member 921, asecond portion 1052 extended from one end of the first portion 1051 andbeing in contact with the ground pad 761 electrically connected to theground layer 762 of the device substrate 760 and exposed to the firstsubstrate surface 7601, and a third portion 1053 extended from the otherend of the first portion 1051 and connected to the vapor chamber 910through the second thermally conductive member 922. The second portion1052 may be electrically connected to the ground pad 761 of the devicesubstrate 760 through at least one of a screw, soldering, conductivebonding, a conductive tape, a conductive sponge, or a conductive clip.Each of the first thermally conductive member 921 and the secondthermally conductive member 922 may be formed of at least one of aconductive tape, a conductive TIM, or a conductive sponge havingexcellent thermal conductivity.

Noise emitted from the antenna module 500 may be shielded by a groundstructure extended through the first portion 1051 and the second portion1052 of the conductive member 1050 electrically connected from theconductive shielding layer 594 to the ground layer 762 of the devicesubstrate 760. High-temperature heat emitted from the antenna module 500may be dissipated to both the ground layer 762 of the device substrate760 and the vapor chamber 910 through the first portion 1051, the secondportion 1052, and the third portion 1053 of the conductive member 1050.

FIG. 11 is an illustration in which, without a separate vapor chamber,the ground layer 762 of the device substrate 760 is used as both aground structure for noise shielding and a heat dissipation structure.

Referring to FIG. 11, the electronic device 1100 may include aplate-type conductive member 1150 that is attached to the conductiveshielding layer 594 of the antenna module 500 and is electricallyconnected to the ground layer 762 of the device substrate 760. Theconductive member 1150 may include a first portion 1151 connected to theconductive shielding layer 594 of the antenna module 500 through thefirst thermally conductive member 921, and a second portion 1152extended from the first portion 1151 and electrically connected to theground layer 762 of the device substrate 760. The second portion 1152may be in contact with the ground pad 761 exposed to the first substratesurface 7601 of the device substrate 760. The second portion 1152 may befixed to the device substrate 760 through a screw S. The second portion1152 may be in contact with the ground pad 761 of the device surface 760through a conductive tape, soldering, a conductive sponge, a conductiveTIM, or a conductive clip. The screw S may penetrate the second portion1152 of the conductive member 1150 and the device substrate 760 and thenbe fastened to the support member 711, thus, simultaneously fixing thesecond portion 1152 and the device substrate 760 in the inner space 7001of the electronic device 1100. When the support member 711 is formed ofa conductive material, an insulating material (e.g., an insulatingbushing and/or an insulating washer) may be further interposed betweenthe screw S and the support member 711.

Noise emitted from the antenna module 500 may be shielded by a groundstructure extended through the first portion 1151 and the second 1152 ofthe conductive member 1150 electrically connected from the conductiveshielding layer 594 to the ground layer 762 of the device substrate 760.In addition, the high-temperature heat emitted from the antenna module500 may be dissipated to the ground layer 762, formed in a relativelylarge area of the device substrate 760, through the conductive member1150.

FIG. 12 is an illustration of a conductive member 1250 connected to thedevice substrate 760 whose arrangement position is changed in theelectronic device 1200.

Referring to FIG. 12, the electronic device 1200 may include theplate-type conductive member 1250 that is attached to the conductiveshielding layer 594 of the antenna module 500 and is electricallyconnected to the ground layer 762 of the device substrate 760. Theconductive member 1250 may include a first portion 1251 connected to theconductive shielding layer 594 of the antenna module 500 through thefirst thermally conductive member 921, and a second portion 1252extended from the first portion 1251 and electrically connected to theground layer 762 of the device substrate 760. The second portion 1252may be in contact with a ground pad 763 exposed to the second substratesurface 7602 of the device substrate 760. The second portion 1252 may bein contact with the ground pad 763 of the device surface 760 through ascrew, soldering, conductive bonding, a conductive tape, a conductivesponge, a conductive TIM, or a conductive clip.

Noise emitted from the antenna module 500 may be shielded by a groundstructure extended through the first portion 1251 and the second portion1252 of the conductive member 1250 electrically connected from theconductive shielding layer 594 to the ground layer 762 of the devicesubstrate 760. In addition, the high-temperature heat emitted from theantenna module 500 may be dissipated to the ground layer 762, formed ina relatively large area of the device substrate 760, through theconductive member 1250.

Referring to FIG. 13, the electronic device 1300 may include aconductive carrier 1350 that is attached to the conductive shieldinglayer 594 of the antenna module 500 and is electrically connected to theground layer 762 of the device substrate 760. The conductive carrier1350 may include a body 1351 that supports the antenna module 500 whilesurrounding the PCB 590 from the second surface 592 up to at least aportion of the first surface 591. In the conductive carrier 1350, afirst portion 1351 a of the body 1351 facing the conductive shieldinglayer 594 may be formed of a conductive material (e.g., metal), and asecond portion 1351 b of the body 1351 supporting the first surface 591of the PCB 590 may be formed of a non-conductive material (e.g.,polymer). This is to prevent the radiation performance of the antennaarray AR1 from being degraded in a lateral direction through the firstsurface 591. The first portion 1351 a and the second portion 1351 b ofthe body 1351 may be integrally formed through an insert injectionprocess of the conductive material and the non-conductive material. Theconductive carrier 1350 may include a conductive extension 1352 extendedfrom the first portion 1351 a in a longitudinal direction of the devicesubstrate 760. The conductive extension 1352 may be in contact with theground pad 761 exposed to the first substrate surface 7601 of the devicesubstrate 760. The conductive extension 1352 may be in contact with theground pad 761 of the device substrate 760 through a screw, a conductivetape, soldering, a conductive sponge, a conductive TIM, or a conductiveclip. As shown in FIG. 12, the conductive extension 1352 may be incontact with a ground pad 763 exposed to the second substrate surface7602 of the device substrate 760.

Noise emitted from the antenna module 500 may be shielded by a groundstructure extended through the first portion 1351 a and the conductiveextension 1352 of the conductive carrier 1350 electrically connectedfrom the conductive shielding layer 594 to the ground layer 762 of thedevice substrate 760. In addition, the high-temperature heat emittedfrom the antenna module 500 may be dissipated to the ground layer 762,formed in a relatively large area of the device substrate 760, throughthe conductive carrier 1350.

FIG. 14 is a cross-sectional view partially showing an electronic device1400 including an antenna module 500 according to an embodiment.

Referring to FIG. 14, the electronic device 1400 may be similar, atleast in part, to the electronic device 101 of FIG. 1 or the electronicdevice 300 of FIG. 3A, or may include other embodiments of theelectronic device 1400.

The electronic device 1400 may include the device substrate 760 and theantenna module 500 mounted, at least in part, on the device substrate760. The device substrate 760 may be disposed in parallel with the rearplate 740 in the inner space 7001. When the rear plate 740 is viewedfrom above, the antenna module 500 may be disposed to be overlapped, atleast in part, with the first substrate surface 7601 of the devicesubstrate 760, so that a beam pattern of the antenna module 500 may beformed in a direction (denoted by an arrow) of the rear plate 740.

The antenna module 500 may be disposed such that at least a portion ofthe conductive shielding layer 594 is in direct contact with the groundpad 761 exposed to the first substrate surface 7601 of the devicesubstrate 760. For example, the conductive shielding layer 594 of theantenna module 500 may be in contact with the ground pad 761 of thedevice substrate 760 through a thermally conductive member 921 such as ascrew, a conductive tape, soldering, a conductive sponge, a conductiveTIM, or a conductive clip. A certain conductive member may be furtherdisposed between the conductive shielding layer 594 and the ground pad761. In this case, the above-described thermally conductive member 921may be further interposed between the conductive shielding layer 594 andthe conductive member.

The first thermally conductive member 921 and/or the second thermallyconductive member 922 described with reference to FIGS. 9 to 14 may bereplaced with the thermally conductive member 560 for electric shockprevention described above with reference to FIG. 7.

As described hereinbefore in various embodiments of the disclosure,noise shielding and a heat dissipation structure may be provided in anantenna module. This structure may not only prevent radiationperformance from being degraded due to signal interference with othernearby antenna modules, but also effectively remove high-temperatureheat generated from the antenna module.

According to various embodiments of the disclosure, an electronic devicemay include a housing that includes a conductive portion. The electronicdevice may include an antenna module disposed in an inner space of thehousing. The antenna module may include a printed circuit board (PCB)disposed in the inner space and including a first surface and a secondsurface facing a direction opposite to the first surface, at least oneantenna element disposed on the first surface of the PCB or near thefirst surface in the PCB, a wireless communication circuit disposed onthe second surface and configured to transmit and/or receive a radiosignal through the at least one antenna element, a protective memberdisposed on the second surface of the PCB to surround at least partiallythe wireless communication circuit, and a conductive shielding layerdisposed on the protective layer. The electronic device may furtherinclude a conductive member connected to the conductive portion of thehousing and facing the conductive shielding layer of the antenna moduleat least in part.

According to various embodiments, the housing may include anon-conductive portion (e.g., the polymer portion 722 in FIG. 7)connected to the conductive portion, and the antenna module may bedisposed such that the at least one antenna element forms a beam patternthrough the non-conductive portion.

According to various embodiments, the electronic device may furtherinclude a thermally conductive member for electric shock preventionpositioned to contact the conductive shielding layer and the conductivemember. At least a part of a noise generated by the wirelesscommunication circuit in a direction different from a radiationdirection of the antenna module may be passed to the conductive memberthrough the thermally conductive member, and a current passed to theconductive member through the thermally conductive member may bereduced.

According to various embodiments, the thermally conductive member forelectric shock prevention may include a first layer formed of aconductive material and facing the conductive shielding layer, and athird layer formed of a dielectric material, interposed between thefirst and second layers, and containing at least one of thermallyconductive fillers.

According to various embodiments, the third layer may have a firstdielectric constant, and the at least one thermally conductive fillermay have a second dielectric constant higher than the first dielectricconstant.

According to various embodiments, the thermally conductive member forelectric shock prevention may have a specific capacitance, and analternating current (AC) coupling may be formed between the conductiveshielding layer and the conductive member, based on the specificcapacitance.

According to various embodiments, the specific capacitance may have arange of 40 pF to 60 pF.

According to various embodiments, a heat generated by at least a part ofthe antenna module may be transferred to the conductive member throughthe thermally conductive member for electric shock prevention.

According to various embodiments, the electronic device may furtherinclude a thermally conductive member interposed between the conductivemember and the conductive portion.

According to various embodiments, the PCB may include a ground layer,and the conductive shielding layer may be electrically connected to theground layer.

According to various embodiments of the disclosure, an electronic devicemay include a housing. The electronic device may further include adevice substrate disposed in an inner space of the housing and includinga first ground layer, and an antenna module disposed adjacent to thedevice substrate. The antenna module may include a printed circuit board(PCB) disposed in the inner space and including a first surface and asecond surface facing a direction opposite to the first surface, atleast one antenna element disposed on the first surface of the PCB ornear the first surface in the PCB, a wireless communication circuitdisposed on the second surface and configured to transmit and/or receivea radio signal through the at least one antenna element, a protectivemember disposed on the second surface of the PCB to surround at leastpartially the wireless communication circuit, and a conductive shieldinglayer disposed on the protective layer. The electronic device mayfurther include a conductive member disposed in the inner space andincluding a first portion electrically connected to the conductiveshielding layer and a second portion connected to the first portion andelectrically connected to the first ground layer of the devicesubstrate.

According to various embodiments, the device substrate may furtherinclude a ground pad electrically connected to the first ground layerand exposed to outside, and the second portion may be in contact withand/or fixed to the ground pad.

According to various embodiments, the second portion may be electricallyconnected to the ground pad through at least one of a screw, soldering,conductive bonding, a conductive tape, a conductive sponge, or aconductive clip.

According to various embodiments, the electronic device may furtherinclude a thermally conductive member interposed between the firstportion and the conductive shielding layer.

According to various embodiments, the thermally conductive member mayinclude at least one of a conductive tape, a thermal interface material(TIM), or a conductive sponge.

According to various embodiments, the electronic device may furtherinclude a vapor chamber disposed in the inner space, and the conductivemember may further include a third portion extended from the firstportion and/or the second portion and being in physical contact with thevapor chamber.

According to various embodiments, the conductive member may furtherinclude a third portion extended from the first portion and formed tosurround at least a portion of the first surface of the PCB.

According to various embodiments, the third portion may include apolymer portion insert-injected into the first portion.

According to various embodiments, the housing may include a conductiveportion and a polymer portion connected to the conductive portion, andthe antenna module may be disposed such that the at least one antennaelement forms a beam pattern through the polymer portion.

According to various embodiments, the PCB may include a second groundlayer, and the conductive shielding layer may be electrically connectedto the second ground layer.

According to various embodiments of the disclosure, a portablecommunication device may include a housing including a conductiveportion forming at least a part of a lateral surface of the portablecommunication device. The portable communication device may include anantenna module disposed in the housing and including a printed circuitboard (PCB) having a first surface facing the lateral surface and asecond surface facing a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the lateral surface, and a communicationcircuit disposed on the second surface and electrically connected to theone or more antennas. The portable communication device may furtherinclude a shielding member surrounding at least in part thecommunication circuit, a support member supporting the antenna moduleand having a conductive material, and an electric shock preventionmember positioned to contact the shielding member and the supportmember. At least a part of a noise generated by the communicationcircuit in a direction different from a radiation direction of theantenna module may be passed to the support member through the electricshock prevention member, and a current passed to the support memberthrough the electric shock prevention member may be reduced.

According to various embodiments, the at east a part of a noise may havea specified frequency band.

According to various embodiments, a heat generated by at least a part ofthe antenna module may be passed to the support member through theelectric shock prevention member.

According to various embodiments, the electric shock prevention membermay have a specific capacitance, and an alternating current (AC)coupling may be formed between the shielding member and the supportmember, based on the specific capacitance.

According to various embodiments, the specific capacitance may have arange of 40 pF to 60 pF.

According to various embodiments, the electric shock prevention membermay include a first conductive layer, a second conductive layer, anon-conductive layer positioned between the first conductive layer andthe second conductive layer, and at least one thermally conductivemember penetrating through the non-conductive layer and connected to thefirst and second conductive layers.

According to various embodiments, the non-conductive layer may have afirst dielectric constant, and the at least one thermally conductivemember may have a second dielectric constant higher than the firstdielectric constant.

According to various embodiments, at least one of the first and secondconductive layers may include an anisotropic conductive film.

According to various embodiments, the at least one thermally conductivemember may include ceramic.

According to various embodiments, the electronic device may furtherinclude a non-conductive portion positioned between the housing and theantenna module.

According to various embodiments, the electronic device may furtherinclude a protective member positioned between the second surface andthe shielding member to surround at least a part of the communicationcircuit.

According to various embodiments, the shielding member may be formed asa part of the antenna module such that a first ending portion and asecond ending portion of the shielding member contact the second surfacein a first direction.

According to various embodiments, the electronic device may furtherinclude a protective member that may be formed as a part of the antennamodule so as to contact the shield member in a second direction oppositeto the first direction.

According to various embodiments, the support member may be extendedintegrally from the conductive portion.

According to various embodiments, the housing may include a supportportion extended from the conductive portion into the housing andparallel to a front surface of the portable communication device, andthe support member may be positioned at least partially oblique to thesupport portion.

According to various embodiments of the disclosure, a portablecommunication device may include a housing including a conductiveportion forming at least a part of a lateral surface of the portablecommunication device. The portable communication device may include anantenna module disposed in the housing and including a printed circuitboard (PCB) having a first surface facing the lateral surface and asecond surface facing a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the lateral surface, and a communicationcircuit disposed on the second surface and electrically connected to theone or more antennas. The portable communication device may furtherinclude a shielding member surrounding at least in part thecommunication circuit, a support member supporting the antenna moduleand having a conductive material, and an electric shock preventionmember positioned to contact the shielding member and the support memberand having a specific capacitance. An alternating current (AC) couplingmay be formed between the shielding member and the support member, basedon the specific capacitance.

According to various embodiments, the specific capacitance may have arange of 40 pF to 60 pF.

According to various embodiments of the disclosure, a portablecommunication device may include an antenna module including a printedcircuit board (PCB) having a first surface and a second surface facing adirection opposite to the first surface, one or more antennas disposedon at least a portion of the PCB to transmit or receive a signal throughthe first surface, and a communication circuit disposed on the secondsurface and electrically connected to the one or more antennas. Theportable communication device may further include a shielding membersurrounding at least in part the communication circuit, and an electricshock prevention member positioned to contact the shielding member. Atleast a part of a noise generated by the communication circuit in adirection different from a radiation direction of the antenna module maybe passed through the electric shock prevention member, and a currentpassed through the electric shock prevention member may be reduced.

According to various embodiments of the disclosure, an antenna modulemay include a printed circuit board (PCB) having a first surface and asecond surface facing a direction opposite to the first surface, one ormore antennas disposed on at least a portion of the PCB to transmit orreceive a signal through the first surface, a communication circuitdisposed on the second surface and electrically connected to the one ormore antennas, a shielding member surrounding at least in part thecommunication circuit, and an electric shock prevention memberpositioned to contact the shielding member. At least a part of a noisegenerated by the communication circuit in a direction different from aradiation direction of the antenna module may be passed through theelectric shock prevention member, and a current passed through theelectric shock prevention member may be reduced.

According to various embodiments, the electric shock prevention membermay have a specific capacitance, and based on the specific capacitance,an alternating current (AC) coupling may be formed between the supportmember and the shielding member both of which contact the electric shockprevention member.

While the disclosure has been particularly shown and described withreference to embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the scope of the subject matter as defined by theappended claims.

What is claimed is:
 1. An electronic device, comprising: a housingincluding a conductive portion; an antenna module comprising: a printedcircuit board (PCB) including a first surface and a second surfacefacing a direction opposite to the first surface; at least one antennaelement disposed on the first surface of the PCB or near the firstsurface in the PCB; a wireless communication circuit disposed on thesecond surface and configured to transmit and/or receive a radio signalthrough the at least one antenna element; a protective member disposedon the second surface of the PCB and configured to surround at leastpartially the wireless communication circuit; and a conductive shieldinglayer disposed on the protective member; and a conductive memberconfigured to support the antenna module with conductive shielding layerof the antenna module facing the conductive member, wherein the antennamodule supported by the conductive member is disposed in an inner spaceof the housing, the conductive member is configured to transfer heatgenerated by the antenna module to the conductive portion of thehousing, and the conductive member is constructed of metal materialdifferent from the conductive portion of the housing.
 2. The electronicdevice of claim 1, wherein the housing includes a non-conductive portionconnected to the conductive portion, and wherein the antenna module isconfigured such that the at least one antenna element forms a beampattern through the non-conductive portion.
 3. The electronic device ofclaim 1, further comprising a thermally conductive member for electricshock prevention positioned to contact the conductive shielding layerand the conductive member, wherein at least a part of a noise generatedby the wireless communication circuit in a direction different from aradiation direction of the antenna module is passed to the conductivemember through the thermally conductive member, and wherein a currentpassed to the conductive member through the thermally conductive memberis reduced.
 4. The electronic device of claim 3, wherein the thermallyconductive member for electric shock prevention comprises: a first layerformed of a conductive material and facing the conductive member: asecond layer formed of a conductive material and facing the conductiveshielding layer; and a third layer formed of a dielectric material,interposed between the first layer and the second layer, and at leastone thermally conductive filler.
 5. The electronic device of claim 4,wherein the third layer has a first dielectric constant, and the atleast one thermally conductive filler has a second dielectric constanthigher than the first dielectric constant.
 6. The electronic device ofclaim 3, wherein the thermally conductive member for electric shockprevention has a specific capacitance, and an alternating current (AC)coupling is formed between the conductive shielding layer and theconductive member, based on the specific capacitance.
 7. The electronicdevice of claim 6, wherein the specific capacitance has a range of 40 pFto 60 pF.
 8. The electronic device of claim 3, wherein a heat generatedby at least a part of the antenna module is transferred to theconductive member through the thermally conductive member for electricshock prevention.
 9. The electronic device of claim 1, furthercomprising a thermally conductive member interposed between theconductive member and the conductive portion.
 10. The electronic deviceof claim 1, wherein the PCB includes a ground layer, and wherein theconductive shielding layer is electrically connected to the groundlayer.
 11. An electronic device, comprising: a housing; a devicesubstrate disposed in an inner space of the housing and including afirst ground layer; an antenna module disposed adjacent to the devicesubstrate and including: a printed circuit board (PCB) disposed in theinner space, including a first surface and a second surface facing adirection opposite to the first surface; at least one antenna elementdisposed on the first surface of the PCB or near the first surface inthe PCB; a wireless communication circuit disposed on the second surfaceand configured to transmit and/or receive a radio signal through the atleast one antenna element; a protective member disposed on the secondsurface of the PCB and configured to surround at least partially thewireless communication circuit; and a conductive shielding layerdisposed on the protective layer; and a conductive member disposed inthe inner space and including a first portion electrically connected tothe conductive shielding layer and a second portion connected to thefirst portion and electrically connected to the first ground layer ofthe device substrate.
 12. The electronic device of claim 11, wherein thedevice substrate further includes a ground pad electrically connected tothe first ground layer and exposed to outside, and wherein the secondportion is in contact with and/or fixed to the ground pad.
 13. Theelectronic device of claim 12, wherein the second portion iselectrically connected to the ground pad through at least one of ascrew, soldering, conductive bonding, a conductive tape, a conductivesponge, or a conductive clip.
 14. The electronic device of claim 11,further comprising a thermally conductive member interposed between thefirst portion and the conductive shielding layer.
 15. The electronicdevice of claim 14, wherein the thermally conductive member includes atleast one of a conductive tape, a thermal interface material (TIM), or aconductive sponge.
 16. The electronic device of claim 11, furthercomprising a vapor chamber disposed in the inner space, wherein theconductive member further includes a third portion extended from thefirst portion and/or the second portion and in physical contact with thevapor chamber.
 17. The electronic device of claim 11, wherein theconductive member further includes a third portion extended from thefirst portion and configured to surround at least a portion of the firstsurface of the PCB.
 18. The electronic device of claim 17, wherein thethird portion includes a polymer portion insert-injected into the firstportion.
 19. The electronic device of claim 11, wherein the housingincludes a conductive portion and a polymer portion connected to theconductive portion, and wherein the antenna module is configured suchthat the at least one antenna element forms a beam pattern through thepolymer portion.
 20. The electronic device of claim 11, wherein the PCBincludes a second ground layer, and wherein the conductive shieldinglayer is electrically connected to the second ground layer.